ESD PLA is an advanced ESD-safe material designed for use in critical applications that require protection against electrostatic discharge (ESD). It is manufactured using state-of-the-art multi-walled carbon nanotube technology, cutting-edge compounding technology, and precise extrusion processes. Typical applications include:

• Semi-con: Hard drive components, enclosures, wafer handling, devices, housings, and connectors
• Industrial: Devices, conveying, dosing, end-of-arm tools, and sensor applications

Target conductivity for 3DXSTAT ESD PLA specification: 10^6 to 10^9 Ohm surface resistance on a 3DP sample using the concentric ring method, with a target of 10^7 Ohm.

Note: Internal studies have shown that increased extruder temperatures can achieve higher conductivity. Similarly, lower extruder temperatures have resulted in lower conductivities. Each printer is set up differently and has different part geometries. Therefore, expect some testing time to understand how this filament performs in your specific printer or application.

The surface resistance of the printed ESD-safe part depends on the extruder temperature of the printer. For example, if your tests indicate that the part is too insulating, increasing the extruder temperature will improve conductivity. Thus, the surface resistance can be adjusted by modifying the extruder temperature up or down based on the measurements you obtain from your side.