The Thermalright TF7 is a high-performance thermal paste specifically designed for efficient heat transfer between processors and cooling systems. With a thermal conductivity of 12.8 W/m·K, it ensures optimal cooling and contributes to the stability and longevity of computer components. The TF7 is available in a convenient 2 g packaging that allows for easy application. This thermal paste is ideal for use in high-performance PCs, gaming systems, and other applications where effective heat dissipation is crucial. The maximum operating temperature of 250 °C ensures that the paste performs reliably even under extreme conditions. The TF7 offers an excellent density of 2.8 g/cm³ and a low thermal resistance of 0.01 K/W, making it an outstanding choice for anyone who values efficient cooling.

• Thermal conductivity of 12.8 W/m·K for optimal heat transfer
• Maximum operating temperature of 250 °C
• Low thermal resistance of 0.01 K/W
• Density of 2.8 g/cm³ for improved application properties.