The photo-coated printed circuit board material from Bungard is a high-quality base material specifically designed for the production of printed circuit boards. With dimensions of 210 x 300 mm and a thickness of 1.5 mm, it provides an ideal foundation for various electronic applications. The single-sided copper layer with a thickness of 35 µm enables precise and reliable connections of components. The positive coating ensures that the material is suitable for photolithographic processes, facilitating the production of complex circuits. Manufactured in Germany, this product meets high quality standards and is an excellent choice for professionals in the electronics field.

• Single-sided copper layer with a thickness of 35 µm
• Positive coated material for photolithographic applications
• Manufactured in Germany
• Optimal dimensions for versatile applications.