The FR4 raw material from Bungard is a high-quality base plate for the production of printed circuit boards. With dimensions of 200 x 300 mm and a thickness of 1.5 mm, this double-sided material provides a reliable foundation for various electronic applications. The copper coating of 35/35 µm ensures excellent conductivity and is ideal for prototype development or use in mass production. The uncoated raw material allows for flexible processing and adaptation to specific requirements. This product is an essential accessory for professionals in electrical engineering and electronics.

• Double-sided copper coating of 35/35 µm
• Uncoated raw material for flexible processing
• Ideal for prototypes and mass production
• High-quality base plate for electronic applications.