Name: Epyc 7302P
Brand: AMD
SKU: 12279507
Price: 375 EUR
Availability: InStock
Rating: 5 (1 reviews)

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The AMD EPYC 7302P processor is a powerful solution for servers and workstations that rely on high computing performance. With 16 cores and 32 threads, this processor offers impressive multitasking capabilities, enabling efficient execution of multiple applications simultaneously. The base clock frequency of 3.0 GHz can be boosted to up to 3.3 GHz through boost technology, allowing for flexible adaptation to the requirements of each application. The EPYC 7302P is equipped with a generous 128 MB L3 cache, significantly enhancing data processing speed. Support for DDR4 SDRAM with memory clock rates of up to 3200 MHz and the octa-channel memory architecture provide a high memory bandwidth of up to 204.8 GB/s. These features make the processor ideal for demanding applications in data centers and for mission-critical tasks.

- Maximum turbo frequency of 3.3 GHz for improved performance under load
- Supports ECC memory for enhanced data security and reliability
- 7 nm manufacturing technology for improved energy efficiency
- Octa-channel memory architecture for high memory bandwidth
- Compatible with the SP3 socket for easy integration into existing systems.

Actual product image AMD Epyc 7302P (SP3, 3 GHz, 16 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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