The FR4 raw material from Bungard is a high-quality base material for printed circuit boards, making it ideal for various applications in electronics. With dimensions of 200 x 300 mm and a thickness of 1.5 mm, it provides a solid foundation for the production of single-sided boards. The copper layer is single-sided and has a thickness of 35 µm, ensuring a reliable electrical connection. The uncoated raw material allows for flexible processing and adaptation to specific requirements. This product is particularly suitable for professionals and hobbyists looking to realize custom circuit board projects. The use of FR4 material ensures high thermal stability and electrical insulation, making it a preferred choice in electrical engineering.

• Single-sided copper layer with a thickness of 35 µm
• Uncoated raw material for flexible processing
• High thermal stability and electrical insulation
• Ideal for custom circuit board projects.