Name: AMD EPYC 9654 CPU FOR-STOCK
Brand: HPE
SKU: 23898258
Price: 33899 EUR
Availability: InStock
Rating: 5 (1 reviews)

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The AMD EPYC 9654 processor from Hewlett Packard Enterprise is a powerful CPU designed specifically for demanding computing tasks. With a base clock frequency of 2.4 GHz and the ability to reach up to 3.7 GHz in Turbo mode, this processor delivers impressive performance for memory-intensive applications. The architecture features 96 cores and 192 threads, enabling efficient processing of parallel tasks, making it ideal for modern data centers and high-performance computing environments. The processor supports DDR5 SDRAM with a maximum memory clock rate of 4800 MHz and is equipped with a dodeca-channel memory interface, significantly enhancing data processing bandwidth and speed. With a maximum Thermal Design Power (TDP) of 360 watts, the EPYC 9654 is designed for use in high-performance servers that demand substantial computing power.

- 96 cores and 192 threads for parallel processing
- Maximum Turbo clock frequency of 3.7 GHz
- Supports DDR5 SDRAM at 4800 MHz
- Dodeca-channel memory architecture for high bandwidth
- 384 MB L3 cache for improved data processing.

Actual product image HPE AMD EPYC 9654 CPU FOR-STOCK (SP5, 2.40 GHz, 96 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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