Name: Core i5 i5-14400F - 2.5 GHz - 10 K
Brand: Intel
SKU: 43382002
Price: 140.52 EUR
Availability: InStock

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Intel

The Intel Core i5-14400F is a powerful processor designed for desktop applications. With a base clock speed of 2.5 GHz and the ability to reach up to 4.7 GHz in Turbo mode, this processor delivers impressive performance for a variety of applications, from everyday tasks to demanding software. It belongs to the Intel® Core™ i5 family and utilizes the LGA 1700 socket, making it compatible with a wide range of motherboards. The processor features 10 cores and 16 threads, enabling efficient multitasking performance. With a maximum supported RAM of 192 GB and the capability to use both DDR4 and DDR5 memory, the i5-14400F is well-equipped for future requirements. The dual-channel memory architecture enhances bandwidth and performance, while the 20 MB L3 cache further optimizes data processing.

- 10 cores and 16 threads for efficient multitasking
- Maximum Turbo clock speed of 4.7 GHz
- Supports up to 192 GB of RAM with DDR4 and DDR5 memory
- Dual-channel memory architecture for improved performance
- PCI Express version 5.0 for faster data transfers.

Actual product image Intel Core i5 i5-14400F - 2.5 GHz - 10 K (LGA 1700, 2.50 GHz, 10 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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