Name: Xeon E3-1270 V5
Brand: Intel
SKU: 5679794
Price: 599 EUR
Availability: InStock

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Intel

The Intel® Xeon® Processor E3-1200 v5 product family: a versatile platform for various business needs. Companies of all sizes must keep pace with a multitude of factors—from dynamic market developments to growing customer expectations, as well as the vast amounts of applications and data. To support their customers and ultimately achieve growth, creative measures are essential. Discover platforms featuring the latest Intel® Xeon® Processor E3-1200 v5 family, a smart investment for a wide range of requirements from businesses of all sizes.

Powerful media delivery. Benefit from enhanced performance for transcoding HD and UHD videos—with up to 18 AVC video transcodings per processor and up to 2 HEVC transcodings per processor.

Brilliant remote applications. With the improved graphics performance of the Intel® Iris™ Pro Graphics P580, you can deliver vividly rendered applications with fantastic image quality to users at remote locations.

Lower costs. Make extensive video content more accessible to even more consumers and businesses—with multi-processor servers and high-density appliances that can deliver HD and UHD video content without the need for additional graphics cards.

High image quality. With state-of-the-art video encoding capabilities for visibly improved image quality and flexible combinations of encoding speed and video quality, Intel® Media Server Studio ensures an enhanced graphics experience.

Actual product image Intel Xeon E3-1270 V5 (LGA 1151, 3.60 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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