With the Compute Module 3+, you can integrate the functionality of Raspberry Pi into your industrial design. The Compute Module 3+ builds on the release of the Pi 3+ to reflect updates in thermal design and processor housing.

The Compute Module 3+ is a prototype development aimed at business and industrial users.

The CM3+ has the same core and features the Broadcom SoC BCM2837B0 from the Raspberry Pi 3 Model B+. The Pi Compute Module is smaller and can be integrated into designs. The module is based on the SODIMM standard, allowing you to use standard connectors for integration into systems and other products.

All modules are CE and FCC compliant.

The Raspberry Pi CM3+ will be produced until at least January 2024.

Specifications of the Compute Module 3+
RAM: 1 GB LPDDR2-SDRAM
Processor: Broadcom BCM2837B0, Cortex-A53 64-bit SoC at 1.2 GHz
Multimedia: H.264, MPEG-4 decoding (1080p30), H.264 encoding (1080p30), OpenGL ES 1.1, 2.0
Operating System: NOOBS_3_0_0 (November 16, 2018) or higher
Board dimensions: 67.6 mm x 31.1 mm x 3.7 mm (highest component)
Board weight: 9 grams.