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Best selling Soldering iron accessories from Almit

On this page you’ll find a ranking of the best Soldering iron accessories from Almit. To give you a quick overview, we’ve added the most important product details. This page always stays fresh and updates automatically.

1. Almit Solder wire, SR-LA SJM-03-S, 1.0 mm, 500 g

The new all-rounder! A solution for every situation - with the SR-LA from Almit, you have a true universal solder wire with halogen-activated flux for a wide range of applications. Specifically developed for low-silver alloys, the SR-LA exhibits excellent wetting properties and minimal flux spattering. Another advantage: the SR-LA is also perfectly suited for use at very low soldering temperatures. Non-wettable soldering tips are a thing of the past with this alloy. Special additives keep the solder tip wettable and reduce tip wear to a minimum. Alloy with increased tensile and tear strength, tip-friendly alloy.

Features:
- Application areas in piston soldering and induction soldering
- Tip-friendly alloy
- Versatile use
- Excellent wetting properties
- Very little flux spattering
- Suitable for low temperatures
- RoHS compliant

Selection criteria:
Wire diameter: 1.0 mm
Spool size: 500 g

Technical data:
Alloy: Sn-0.3Ag-0.7Cu-2.0Bi-0.035Fe
Flux class: ROM1
Flux: SR-LA
Flux content: 3.5%
Melting range: 210-226 °C
Weight: 500 g. 

2. Almit Solder paste filler, ESD

Ergonomically shaped ESD spatula. The design ensures complete removal of solder paste from the container.

Features:
- Ergonomically shaped
- Complete emptying of containers guaranteed

Technical data:
Dimensions W x L: 42 x 186 mm
Weight: 50 g. 

3. Almit Solder wire, SR-LA SUPER LFM-48-M, 0.8 mm, 100 g

The new all-rounder! The SR-LA from Almit is a true universal solder wire with halogen-activated flux, suitable for a wide range of applications. Specifically developed for low-silver alloys, the SR-LA exhibits excellent wetting properties and minimal flux spattering. Another advantage: the SR-LA is also ideal for use at very low soldering temperatures. Non-wettable solder tips are a thing of the past with this alloy. Special additives keep the solder tip wettable and reduce tip wear to a minimum.

Features:
- Application range in barrel soldering and induction soldering
- Low soldering temperatures possible
- Versatile use
- Excellent wetting properties
- Very little flux spattering
- RoHS compliant

Selection criteria:
Wire diameter: 0.8 mm
Reel size: 100 g

Technical data:
Alloy: Sn-3.0Ag-0.5Cu
Flux class: ROM1
Flux: SR-LA
Flux content: 3.5 %
Melting range: 217-220 °C
Weight: 100 g. 

4. Almit Solder wire, SR-LA SUPER LFM-48-M, 1.0 mm, 250 g

The new all-rounder! Suitable for all applications - with the SR-LA from Almit, a true universal solder wire with halogen-activated flux is available for a wide range of uses. Specifically developed for low-silver alloys, the SR-LA exhibits excellent wetting properties and minimal flux spattering. Another advantage: the SR-LA is also ideal for use at very low soldering temperatures. Non-wettable solder tips are a thing of the past with this alloy. Special additives keep the solder tip wettable and reduce tip wear to a minimum.

Features:
- Application area in barrel soldering and induction soldering
- Low soldering temperatures possible
- Versatile use
- Excellent wetting properties
- Very little flux spattering
- RoHS compliant

Selection criteria:
Wire diameter: 1.0 mm
Reel size: 250 g

Technical data:
Alloy: Sn-3.0Ag-0.5Cu
Flux class: ROM1
Flux: SR-LA
Flux content: 3.5 %
Melting range: 217-220 °C
Weight: 250 g. 

5. Almit Solder wire, SR-LA SUPER LFM-23-S, 0.8 mm, 100 g

This high-performance alloy without silver impresses with the best properties of an SnCuNi alloy. High quality, reliable, and cost-effective. With a decisive advantage: An innovative iron-gallium compound in LFM-23-S reduces oxidation and minimizes iron wear at the soldering tip. The lifespan of the soldering tips can increase up to five times, helping to reduce manufacturing costs.

Features:
- Five times longer soldering tip lifespan (compared to a conventional SnCuNi alloy)
- Silver-free
- Excellent soldering properties
- With innovative iron-gallium compound
- Higher creep resistance due to the addition of a special nickel content
- Better wetting properties
- RoHS compliant

Selection criteria:
Wire diameter: 0.8 mm
Spool size: 100 g

Technical data:
Alloy: Sn-0.6Cu-0.05Ni-0.035Fe-Ga
Flux class: ROM1
Flux: SR-LA Super
Flux content: 3.5%
Melting range: 228-229 °C
Weight: 100 g

Item number: ALM82362010. 

6. Almit Flux gel BM-1RMA, 5cc cartridge with 6 g

The perfectly tuned supplement for production and repair. Almit flux is designed to prevent crystallization, which is essential for meeting specifications for applications in the aerospace industry.

Features:
- No Clean, ideal for BGA and flip-chip assembly and rework
- Can be applied via stencil or dispenser, either machine or manually
- Excellent wetting

Selection criteria:
Content: 5cc cartridge with 6 g

Technical data:
Color: light yellow
Solid content: 60 %
Density at 20 °C: 1.081 (+/- 0.005) g/cm³
Flash point: >160 °C
Flux classification: ROL0
Weight: 6 g. 

7. Almit Solder wire, SR-LA SUPER LFM-48-M, 0.5 mm, 500 g

The new all-rounder! Suitable for all situations - with the SR-LA from Almit, a true universal solder wire with halogen-activated flux is available for a wide range of applications. Specifically developed for low-silver alloys, the SR-LA exhibits excellent wetting properties and minimal flux spattering. Another advantage: the SR-LA is also well-suited for use at very low soldering temperatures. Non-wettable solder tips are a thing of the past with this alloy. Special additives keep the solder tip wettable and reduce tip wear to a minimum.

Features:
- Application range in barrel soldering and induction soldering
- Low soldering temperatures possible
- Versatile use
- Excellent wetting properties
- Very little flux spattering
- RoHS compliant

Selection criteria:
Wire diameter: 0.5 mm
Spool size: 500 g

Technical data:
Alloy: Sn-3.0Ag-0.5Cu
Flux class: ROM1
Flux: SR-LA
Flux content: 3.5 %
Melting range: 217-220 °C
Weight: 510 g. 

8. Almit Solder wire, SR-37 LFM-48 S, 1.0 mm, 500 g

Problems with tip wear when using lead-free solder wires are almost completely eliminated by a combination of a flux with good wetting properties and a specially developed alloy to minimize tip wear. By reducing the frequency of tip changes, significant cost savings can be achieved.

Features:
- Applications in soldering with a soldering iron and induction soldering
- Particularly suitable for nickel surfaces
- Perfect soldering results at low temperatures
- Perfect soldering results with shorter soldering times

Selection criteria:
Wire diameter: 1.0 mm
Spool size: 500 g

Technical data:
Alloy: Sn-3.0Ag-0.5Cu
Flux class: REM1
Flux: SR-37
Flux content: 3.5%
Melting range: 217-221 °C
Weight: 500 g. 

9. Almit Solder wire, SR-LA SUPER LFM-23-S, 0.5 mm, 500 g

This high-performance alloy without silver impresses with the best properties of an SnCuNi alloy. High-quality, reliable, and cost-effective. With a crucial advantage: An innovative iron/gallium compound in LFM-23-S reduces oxidation and minimizes iron wear at the solder tip. The lifespan of the solder tips can increase by up to five times, thereby helping to reduce manufacturing costs.

Features:
- Five times longer solder tip lifespan (compared to a conventional SnCuNi alloy)
- Silver-free
- Excellent soldering properties
- With innovative iron/gallium compound
- Higher creep resistance due to the addition of a special nickel content
- Better wetting properties
- RoHS compliant

Selection criteria:
Wire diameter: 0.5 mm
Reel size: 500 g

Technical data:
Alloy: Sn-0.6Cu-0.05Ni-0.035Fe-Ga
Flux class: ROM1
Flux: SR-LA Super
Flux content: 3.5 %
Melting range: 228-229 °C
Weight: 500 g

Article number: ALM82363050. 

10. Almit Solder wire, SR-LA SUPER LFM-23-S, 1.0 mm, 500 g

This high-performance alloy without silver impresses with the best properties of an SnCuNi alloy. High quality, reliable, and cost-effective. With a crucial advantage: An innovative iron/gallium compound in LFM-23-S reduces oxidation and minimizes iron loss at the solder tip. The lifespan of the solder tips can increase by up to five times, thereby helping to reduce manufacturing costs.

Features:
- Five times longer solder tip lifespan (compared to a conventional SnCuNi alloy)
- Silver-free
- Excellent soldering properties
- With innovative iron/gallium compound
- Higher creep resistance due to the addition of a special nickel content
- Better wetting properties
- RoHS compliant

Selection criteria:
Wire diameter: 1.0 mm
Spool size: 500 g

Technical data:
Alloy: Sn-0.6Cu-0.05Ni-0.035Fe-Ga
Flux class: ROM1
Flux: SR-LA Super
Flux content: 3.5 %
Melting range: 228-229 °C
Weight: 500 g

Article number: ALM82361550. 

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