Name: Ryzen 7 5700
Brand: AMD
SKU: 42390676
Price: 191.08 EUR
Availability: InStock
Rating: 4.6 (9 reviews)

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The AMD Ryzen 7 5700 Boxed Desktop Processor offers powerful computing performance with 8 cores and 16 threads, a base clock speed of 3.7 GHz, and a maximum boost clock of 4.6 GHz. Based on the advanced AMD Zen 3 architecture, this processor features 20 MB of cache and operates with a TDP of 65 W for efficient power consumption. It is designed for the proven Socket AM4 platform, supports DDR4 memory, and provides unlocked overclocking capabilities for performance enhancement. The processor comes with the high-quality AMD Wraith Spire cooler, ensuring reliable heat management right out of the box. This model provides a solid foundation for desktop systems focused on multitasking, productivity, and gaming applications, with a design that supports future upgrades within the AM4 ecosystem. The neutral black color scheme makes it suitable for a wide range of users and system configurations, emphasizing durability and consistent operation in various computing environments.

Actual product image AMD Ryzen 7 5700 (AM4, 3.70 GHz, 8 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

PCI express version (max.)

Ryzen 7 5700

Processors

CPU coolers

Internal cables (PC)

CPU water coolers

14-day cancellation right
30-day right of return

30-day right of return

General information

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Memory

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Package dimensions

A maximum boost clock of 4.6 GHz enables fast processing of demanding desktop tasks.

High Processing Power

The design for the older AM4 socket restricts the system to DDR4 RAM.

Limited Compatibility

A low TDP of 65 W enables energy-efficient operation with minimal cooling requirements.

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AMD Ryzen 7 5700

At a Glance

High Processing Power

Limited Compatibility

Low Energy Consumption

Sales rank 63 of 413

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AMD Ryzen 7 5700

At a Glance

High Processing Power

Limited Compatibility

Low Energy Consumption

Sales rank 63 of 413

In Detail

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Questions about this product1

Product ratings9

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