Name: Ryzen 9 7900 - 3.7 GHz - 12 Kerne - 24 Threads - 64 MB Cache-Speicher - Socket AM5 - Box
Brand: AMD
SKU: 61011734
Price: 333.89 EUR
Availability: InStock
Rating: 4.8 (159 reviews)

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The AMD Ryzen 9 7900 is a powerful processor designed for demanding desktop applications. With a base clock speed of 3.7 GHz and the ability to handle up to 12 cores and 24 threads, this processor delivers outstanding multitasking performance. The advanced 5nm lithography ensures high energy efficiency and improved performance compared to previous generations. The Ryzen 9 7900 supports DDR5 SDRAM and allows for a maximum memory capacity of up to 128 GB, making it ideal for memory-intensive applications. Additionally, the processor is equipped with AMD Radeon Graphics, providing an integrated graphics solution. The AM5 socket allows for easy integration into modern motherboards and ensures future upgrade possibilities. This processor is therefore an excellent choice for gamers, content creators, and professional users seeking high computational power.

- 12 cores and 24 threads for optimized multitasking performance
- Support for DDR5 SDRAM with up to 128 GB maximum memory
- Integrated AMD Radeon Graphics for basic graphics processing
- Compatible with AM5 socket for modern motherboards
- 5nm lithography for improved energy efficiency and performance.

Actual product image AMD Ryzen 9 7900 - 3.7 GHz - 12 Kerne - 24 Threads - 64 MB Cache-Speicher - Socket AM5 - Box (AM5, 3.70 GHz, 12 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

PCI express version (max.)

Ryzen 9 7900 - 3.7 GHz - 12 Kerne - 24 Threads - 64 MB Cache-Speicher - Socket AM5 - Box

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30-day right of return

30-day right of return

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Graphics processing unit

Memory

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Package dimensions

The 12 processor cores and 24 threads, combined with 64 MB of L3 cache, deliver exceptional processing speeds for multi-threaded applications.

High processing performance

This model requires an AM5 socket motherboard and supports the latest PCI Express 5 standard.

Modern system compatibility

With a maximum TDP of 65W, the processor generates very little heat for its performance class.

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AMD Ryzen 9 7900 - 3.7 GHz - 12 Kerne - 24 Threads - 64 MB Cache-Speicher - Socket AM5 - Box

At a Glance

High processing performance

Modern system compatibility

Low cooling requirements

Sales rank 67 of 413

In Detail

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AMD Ryzen 9 7900 - 3.7 GHz - 12 Kerne - 24 Threads - 64 MB Cache-Speicher - Socket AM5 - Box

At a Glance

High processing performance

Modern system compatibility

Low cooling requirements

Sales rank 67 of 413

In Detail

Description

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Questions about this product15

Product ratings159

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