Name: Wraith Stealth Ryzen AM4 CPU Cooler
Brand: AMD
SKU: 37809583
Price: 38.75 EUR
Availability: InStock

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The Wraith Stealth is a powerful top-blower CPU cooler specifically designed for AMD desktop processors. With near-silent operation, it provides effective cooling that optimizes processor performance. The advanced thermal hardware ensures that temperatures remain low even under heavy load, supporting system stability and longevity. The cooler is easy to install and fits seamlessly into various case configurations. With a compact design and high-quality materials, the Wraith Stealth is an excellent choice for anyone seeking a reliable and efficient cooling solution.

- Maximum speed of 2800 RPM for high cooling performance
- Compatible with AM4 processor socket for versatile applications
- Power consumption of only 65 W, making it energy-efficient.

Actual product image AMD Wraith Stealth Ryzen AM4 CPU Cooler (102 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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