8 in-house designed superconductive composite heat pipes utilize groove and powder wick structure with dual variable heat pipe thickness for maximum efficiency of heat transfer.

Performance dual tower redesign maximizes performance and surface area with optimized fin density and thickness.

Optimized layout consisting of 8 heat pipes ensures heat is transferred to all fin areas for efficient dissipation.

Expanded surface area of the nickel plated copper base provides seamless contact and complete coverage to target all heat zones. Base layer thickness is minimized for faster heat conductivity and lower cooler height for improved case compatibility.

Equipped with dual variable Mobius fans for exceptional silence without compromising performance.

Staggered 120mm and 135mm Mobius fans create an ultimate push-pull setup for perfect airflow and air pressure to maximize heat dissipation.

120mm Mobius fan provides 42mm of RAM clearance to fit a wider range of builds without sacrificing performance.

Stealth Series aluminum top cover and all black hardware provide a premium and clean design.

Pre-applied high performance thermal paste.