The thermal pads offer several advantages over liquid or viscous materials. The pads can be easily cut to the required size, eliminating the uncertainty of applying paste or the mess that can occur during smoothing. The pad offered here by EK Water Blocks is pre-cut into eight smaller pieces, is slightly self-adhesive, and usually stays in place at the assigned position.

Of course, securing it during the further assembly process cannot be completely avoided, as the heat source, thermal pad, and heatsink (or heat dissipation surface) should make as much contact as possible to ensure optimal heat transfer. EKWB maximally supports the user by offering the 120 x 24 mm blue pad in several thicknesses, with the version provided here being 1.5 mm thick. Additionally, the material is pleasantly flexible and adaptable, making it usable in many applications.

To name just a few examples: in RAM water coolers, alternative graphics card coolers, chipset coolers, and many other components where effective heat dissipation is crucial (e.g., on heat sinks, heat pipes, radiators, heatsinks, etc.). Since EKWB thermal pads are electrically non-conductive, there are hardly any limits to creativity with most electronic components. On the other hand, the pads, with a high thermal conductivity of 3.5 W/(m·K), can make many thermal pastes look inferior. The pad presented here is ideal for the chipsets of a memory module, as the overall 120 x 24 mm strip can be cut to size as desired.