Name: CPU Intel Xeon Gold 6526Y 16C 2.8 GHz
Brand: Fujitsu
SKU: 47464608
Price: 3339.06 EUR
Availability: InStock

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Fujitsu

The Fujitsu Intel Xeon Gold 6526Y is a powerful processor specifically designed for server and enterprise applications. With a clock speed of 2.8 GHz and the ability to support up to 4 TB of RAM across eight memory channels, this processor delivers high performance and efficiency for demanding tasks. The 7nm lithography enhances energy efficiency and performance, while support for modern instruction sets like AMX, AVX, and AVX-512 optimizes the processing of complex calculations. The Xeon Gold 6526Y features 16 cores and 32 threads, enabling excellent multitasking capabilities and increasing processing speed in data-intensive environments. These attributes make it an ideal choice for businesses seeking a reliable and powerful CPU.

- Supports a maximum internal memory of 4 TB
- Octa-channel memory architecture for high bandwidth
- Support for DDR5 SDRAM
- Max turbo clock frequency of 3.5 GHz
- 37.5 MB L3 cache for improved data processing.

Actual product image Fujitsu CPU Intel Xeon Gold 6526Y 16C 2.8 GHz (LGA 4677, Socket F, 2.80 GHz, 16 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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