Name: Core i3 14100 14. Nesil 12MB L3
Brand: Intel
SKU: 41876501
Price: 131.43 EUR
Availability: InStock
Rating: 5 (1 reviews)

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Intel

The Intel Core i3-14100 processor is part of the 14th generation Core series and offers a powerful solution for desktop applications. With a base clock speed of 3.5 GHz and a maximum turbo clock speed of up to 4.7 GHz, this processor is capable of handling demanding tasks efficiently. It has four cores and supports eight threads, which enables improved multitasking performance. The integrated UHD 730 graphics processor ensures an appealing visual presentation, while the 12 MB L3 cache speeds up data processing. With a thermal design power (TDP) of 65 watts, the i3-14100 is suitable for both office applications and light gaming scenarios. The processor is compatible with the LGA 1700 socket and supports DDR4 RAM, making it a flexible choice for different system configurations. 

- Maximum turbo clock speed of 4.7 GHz for extra performance
- Supports 8 threads for improved multitasking
- Integrated UHD 730 graphics for basic visual requirements
- Compatible with LGA 1700 socket for modern motherboards.

Actual product image Intel Core i3 14100 14. Nesil 12MB L3 (LGA 1700, 3.50 GHz, 4 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

Core i3 14100 14. Nesil 12MB L3

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Featuring four cores and a turbo clock speed of up to 4.7 GHz, the processor delivers reliable entry-level performance for office tasks.

Solid entry-level performance

Compatibility with the LGA 1700 socket allows for seamless integration with matching desktop motherboards.

LGA 1700 socket compatibility

A maximum power consumption of 110W TDP ensures manageable heat generation during operation.

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Intel Core i3 14100 14. Nesil 12MB L3

At a Glance

Solid entry-level performance

LGA 1700 socket compatibility

Low cooling requirements

Sales rank 82 of 413

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Intel Core i3 14100 14. Nesil 12MB L3

At a Glance

Solid entry-level performance

LGA 1700 socket compatibility

Low cooling requirements

Sales rank 82 of 413

In Detail

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