Name: Core I7-14700F
Brand: Intel
SKU: 41791734
Price: 320.08 EUR
Availability: InStock
Rating: 4.4 (12 reviews)

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Intel

The Intel Core i7 14700F is a desktop processor with 20 cores and a base clock frequency of 2.1 GHz, which can be boosted up to 5.4 GHz using Intel Turbo Boost Max Technology 3.0. This processor uses the LGA-1700 socket and includes a compatible cooler in the package. With 33 MB of Smart Cache and support for dual-channel DDR4 and DDR5 memory up to 192 GB, this processor delivers reliable performance for demanding computing tasks. It supports PCI Express 4.0 and 5.0 standards, providing flexibility for modern graphics cards and storage devices. Measuring 45 mm by 37.5 mm, this silver processor is designed for desktop systems that require significant computing power. As a successor in the Intel Core i7 family, it maintains compatibility with LGA-1700 motherboards while offering enhanced performance features. The included cooler ensures proper heat regulation for sustained operation under various workloads. This processor is suitable for users seeking balanced performance in gaming, content creation, and productivity applications without integrated graphics functionality.

Actual product image Intel Core I7-14700F (LGA 1700, 2.10 GHz, 20 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

PCI express version (max.)

Core I7-14700F

Processors

CPU coolers

Internal cables (PC)

CPU water coolers

14-day cancellation right
30-day right of return

30-day right of return

General information

Processor

Memory

Origin

Product standards

Voluntary climate contribution

Scope of delivery

Legal Notice

Package dimensions

With 20 processor cores, the model delivers high computing power for demanding tasks such as video editing.

High processing performance for applications

Operating the processor requires a motherboard with the LGA 1700 socket from the Intel 600 or 700 chipset series.

Socket compatibility for LGA 1700

Due to a maximum power consumption of 65 W, a significant amount of heat is generated, which requires appropriately powerful cooling.

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Intel Core I7-14700F

At a Glance

High processing performance for applications

Socket compatibility for LGA 1700

High cooling requirement under load

Sales rank 70 of 413

In Detail

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Intel Core I7-14700F

At a Glance

High processing performance for applications

Socket compatibility for LGA 1700

High cooling requirement under load

Sales rank 70 of 413

In Detail

Description

Specifications

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Questions about this product2

Product ratings12

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