Name: Xeon E5-1650 v4
Brand: Intel
SKU: 6195830
Price: 781.89 EUR
Availability: InStock
Rating: 5 (1 reviews)

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Intel

The Intel Xeon E5-1650 v4 is a powerful processor designed for demanding workstation applications. With a base clock frequency of 3.6 GHz and the ability to reach up to 4 GHz in Turbo mode, this processor delivers high computing power for multithreading applications. It features 6 cores and supports 12 threads, allowing for efficient processing of multiple tasks simultaneously. The Xeon E5-1650 v4 is equipped with a generous 15 MB cache, further optimizing data processing speed. The processor is designed for the LGA 2011-v3 socket and supports quad-channel memory with a maximum capacity of 1536 GB, making it ideal for memory-intensive applications. With a Thermal Design Power (TDP) of 140 W, it is suitable for use in high-performance systems that require reliable cooling. Support for modern instruction sets such as AVX 2.0 and integrated virtualization technology make it a versatile choice for professional users.

- Maximum Turbo clock frequency of 4 GHz for additional performance
- Support for up to 1536 GB DDR4 SDRAM
- Hyper-Threading technology for improved multitasking capabilities
- Integrated virtualization techniques (VT-x, VT-d) for optimized server applications
- 14 nm lithography for improved energy efficiency and performance.

Actual product image Intel Xeon E5-1650 v4 (LGA 2011-v3, 3.60 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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