Name: Xeon E5-4650 - 2.7 GHz - 8 cores - 16 threads
Brand: Intel
SKU: 15663227
Price: 319 EUR
Availability: InStock

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Intel

The Intel Xeon E5-4650 is a powerful processor designed for demanding server and workstation applications. With a base clock speed of 2.7 GHz and the ability to reach up to 3.3 GHz in Turbo mode, this processor delivers high computing performance. It features 8 cores and supports 16 threads, enabling efficient multitasking. The Xeon E5-4650 is equipped with a 20 MB L3 cache, further optimizing data processing speed. The processor uses the LGA 2011 socket and is manufactured with a 32-nanometer lithography, making it a reliable choice for modern IT infrastructures. With a maximum Thermal Design Power (TDP) of 130 watts, it is energy-efficient and suitable for use in high-performance systems that require high availability.

- Maximum Turbo clock speed of 3.3 GHz for additional performance
- Supports dual-channel memory architecture for improved data transfer
- Maximum RAM capacity of 393216 MB for extensive applications
- Integrated AES-NI technology for enhanced security
- Compatible with PCI Express 3 for high bandwidth and fast data transfer.

Actual product image Intel Xeon E5-4650 - 2.7 GHz - 8 cores - 16 threads (LGA 2011, 2.70 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

PCI express version (max.)

Xeon E5-4650 - 2.7 GHz - 8 cores - 16 threads

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