The phase-change material on which the PhaseSheet PTM is based is solid at room temperature. The material only begins to liquefy at temperatures above 45 degrees Celsius. A high contact pressure of around 300-400N is required for optimum distribution of the liquid PhaseSheet PTM and thus the lowest possible layer thickness. PhaseSheet PTM has a very low viscosity in its liquid state and contracts again when it changes to a solid material. This minimises the pump-out effect. The pump-out effect is particularly pronounced when combining a copper cooler on a graphics chip because silicon and copper have different linear expansion when heated. The temperatures under load cause the heat spreader and the base plate to deform (concave or convex) and return to their original shape (straight) during cooling. As a result, the thermally conductive paste is slowly pressed out between the heatspreader and the base plate of the CPU cooler, for example. PhaseSheet PTM is more durable than traditional thermal pastes, but not as durable as KryoSheet, for example, which is virtually maintenance-free. The maximum thermal conductivity of PhaseSheet PTM develops and stabilises after around ten heat cycles above 60 degrees Celsius. Brief information Outstanding thermal conductivity Consistently high performance Very long service life Versatile in use Non-electrically conductive Easy to use Scope of delivery 1x PhaseSheet PTM.