The book "Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication" offers a comprehensive analysis of chemical mechanical planarization (CMP), a critical process in semiconductor manufacturing. It highlights the development and application of integrated models that allow for the assessment of the impact of process parameters on the quality and quantity of production. The authors, Jianfeng Luo and David A. Dornfeld, discuss the challenges associated with the continuous miniaturization of components and the use of new materials. This work is aimed at professionals and researchers seeking a deeper understanding of CMP processes and their modeling. Existing literature is referenced to clarify the context and relevance of the topics addressed. The detailed examination of the mechanical elements of the process represents a significant contribution to the advancement of CMP technology.