The Low Density Conductive Foam from RS PRO is a high-quality packaging solution specifically designed to protect sensitive components. With a thickness of 6 mm and a size of 1 m x 1 m, this ESD foam provides an effective barrier against electrostatic discharges. The surface resistance ranges from 1 x 10^6 Ω to 1 x 10^10 Ω, making it ideal for use in sensitive electronic applications. Additionally, the foam features a volume resistivity of ≤ 2.5 x 10^2 Ω, offering extra protection. It is non-corrosive, even at elevated temperatures and humidity, and is excellent for soft packaging that ensures safe storage and transport of delicate components. These characteristics make the Low Density Conductive Foam a reliable choice for companies that prioritize quality and safety.

• Surface resistance of 1 x 10^6 to 1 x 10^10 Ω
• Volume resistivity of ≤ 2.5 x 10^2 Ω
• Non-corrosive at high temperatures and humidity
• Ideal for packaging sensitive components.