The recent boom in the mobile telecommunication market has captured the interest of almost all electronic and communication companies worldwide. New applications arise every day, more countries are covered by digital cellular systems, and the competition among various providers has caused prices to drop rapidly. The creation of this essentially new market would not have been possible without the appearance of small, low-power, high-performance, and certainly low-cost mobile terminals. The evolution in microelectronics has played a dominant role in this by creating digital signal processing (DSP) chips with increasing computing power and combining the discrete components of the RF front-end on a few integrated circuits. This work focuses on the study of the full integration of the RF transceiver on a single die. Furthermore, it aims to ensure compatibility with the devices.