The trend towards miniaturization in the production of electronic assemblies remains unbroken, resulting in increasingly smaller and harder-to-access components that cannot be adequately captured by traditional testing methods. The era in which a single testing procedure was sufficient is long gone. Testing and inspection methods for populated circuit boards such as JTAG/Boundary Scan, Multifunction Test (MFT), In-Circuit Test (ICT), Flying Probe Test (FPT), Automatic Optical Inspection (AOI), or Automatic X-ray Inspection (AXI) are based on electrical, mechanical, or optical properties, each having specific advantages and disadvantages. This book provides an overview of all these methods and explains their fundamental operating principles. Based on this, guidelines for circuit board designers are presented in the form of design recommendations.