Glue Sticks Ø 11 mm Low Melt

With its low melting temperature, the Low-Melt adhesive is particularly suitable for temperature-sensitive materials such as PU foam and polystyrene. With a processing temperature of only 130 °C, it protects the substrate being processed. The material is firm after a maximum of 40 seconds and load-bearing after about 80 to 100 seconds. The time indications and adhesive recommendations are only rough guidelines.