Alphacool's double-sided adhesive core thermal pad can be used for cooling electronic components of all kinds, where effectively dissipating heat is crucial. This significantly improves the performance and longevity of the components. The installation is greatly simplified due to the inherent stickiness of the material.

Flexible and powerful, the thermal pad is reliable and efficient due to its material composition. With its low thickness, it offers a wide range of application possibilities. It can be easily cut to meet individual needs. Thanks to its adhesive nature, effortless mounting of electrical components such as DDR modules, motherboard components, or power supplies is possible.

Technical specifications:
Dimensions (L x W x H): 100 x 100 x 0.25 mm
Thermal conductivity (ASTM D5470): 1 W/mK ±10%
Thickness (ASTM D374): 0.25 mm
Structure: Fiberglass fabric
Continuous operating temperature: -30 to +120 °C
Short-term operating temperature (30 seconds): 180 °C
Density (ASTM D792): 1.2 g/cm³
Holding strength (PSTC-7): >3000 min 180°
Peel strength (Aluminum) (PSTC-101): >16 N / 25 mm
Dielectric breakdown voltage: 3 kV ±10%
Thermal impedance @10 psi (ASTM D5470): 1.26 C-in² / W
Thermal impedance @30 psi (ASTM D5470): 1.06 C-in² / W
Thermal impedance @50 psi (ASTM D5470): 1.05 C-in² / W
Color: white.