These thermal conductive pads are excellent for compensating for height differences and irregularities on heat sinks and the components to be cooled. Their very good elastic compressibility and low hardness allow for a very good adaptation to surfaces with minimal pressure. They compensate for all large and small height differences, from microscopic grooves to visible unevenness. The self-adhesive surface of the pad enables easy installation, preventing any slipping during the mounting of a heat sink. These adhesive pads can also be cut to the desired size. They are suitable for use with RAM coolers on graphics cards as well as for voltage regulators on motherboards. These thermal adhesive pads can even be used for large components such as the North or Southbridge, as they possess excellent thermal conductivity. As a basic component or spare part, thermal adhesive pads belong in every well-organized computer workshop!

Technical details:
Dimensions: 30x30x4mm
Thermal conductivity: 1.5 W/mk
Maximum air gap to bridge: 4 mm
Electrically non-conductive

Delivery includes:
1x thermal pad 30x30x4mm (1 piece)

Note: These thermal pads can be compressed up to half their height.