
Thermal Grizzly PhaseSheet PTM - 50x40mm
0.20 mm
Here’s a ranking of the best selling Thermal pads. To give you a quick overview, we’ve added the most important information about each product. This page always stays fresh and updates automatically.
The phase-change material on which the PhaseSheet PTM is based is solid at room temperature. The material only begins to liquefy at temperatures above 45 degrees Celsius. A high contact pressure of around 300-400N is required for optimum distribution of the liquid PhaseSheet PTM and thus the lowest possible layer thickness. PhaseSheet PTM has a very low viscosity in its liquid state and contracts again when it changes to a solid material. This minimises the pump-out effect. The pump-out effect is particularly pronounced when combining a copper cooler on a graphics chip because silicon and copper have different linear expansion when heated. The temperatures under load cause the heat spreader and the base plate to deform (concave or convex) and return to their original shape (straight) during cooling. As a result, the thermally conductive paste is slowly pressed out between the heatspreader and the base plate of the CPU cooler, for example. PhaseSheet PTM is more durable than traditional thermal pastes, but not as durable as KryoSheet, for example, which is virtually maintenance-free. The maximum thermal conductivity of PhaseSheet PTM develops and stabilises after around ten heat cycles above 60 degrees Celsius. Brief information Outstanding thermal conductivity Consistently high performance Very long service life Versatile in use Non-electrically conductive Easy to use Scope of delivery 1x PhaseSheet PTM.

Thermal Grizzly PhaseSheet PTM - 50x40mm
0.20 mm
Thermal Grizzly presents KryoSheet, a new product that is part of the company's advertised high-performance cooling solutions. The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative to thermal pastes from the higher performance segment. Similar to the Carbonaut pads, they have an adaptable surface with very high thermal conductivity.
The KryoSheet is compatible with:
- AMD CPUs: Socket AM5
- Nvidia GPUs: RTX 2080 ti, Titan RTX.

The GP-Extreme 120×120 is designed to ensure perfect heat transfer to the heat sink when installed on circuit boards with height differences and uneven surfaces, such as microcontroller units, memory ICs, analog ICs, MOSFETs, and other SMD components. Thanks to its softness and excellent thermal conductivity, the GP-Extreme optimally fills gaps and provides the best performance in its class. The GP-Extreme is electrically non-conductive, non-corrosive, non-hardening, and non-toxic. It allows for easy application, and the dimensions of the thermal pad, measuring 120×120 mm, are ideally suited for extra-large circuit board surfaces of GPUs, laptops, gaming consoles, and other densely packed devices.

The Thermal Grizzly Minus Pad Extreme V2 is a highly advanced thermal pad designed for efficient heat transfer in electronic applications. It plays a crucial role in the temperature management of computing systems, particularly in cooling components such as CPUs and GPUs. This thermal pad ensures reliable heat dissipation and optimizes thermal conductivity to maintain system stability even under demanding workloads. The special material composition minimizes thermal interface resistance and provides long-lasting performance while reducing the pump-out effect. The pad is easy to install and requires no manual spreading or curing time, making it ideal for professional workstation configurations and high-performance gaming systems. It operates effectively in a temperature range of -50°C to 200°C and adapts to various environmental conditions. With a recommended storage temperature below 30°C, the material integrity is preserved throughout its lifespan.
- Optimal thermal conductivity for CPUs and GPUs
- Minimizes thermal interface resistance through even pressure distribution
- Reduced pump-out effect for long-lasting performance
- Easy installation without manual spreading
- Effective in a temperature range of -50°C to 200°C.

The high-performance thermal pads of the Thermal Grizzly Minus Pad series feature a highly elastic and adaptable surface with very high thermal conductivity. Even the smallest component differences can be effectively compensated for. Available in various sizes and thicknesses.

The Thermal Grizzly Minus Pad Pro is a highly advanced thermal pad specifically designed for efficient heat transfer in electronic applications. With a size of 100x100 mm and a thickness of 1 mm, it provides an optimal solution for cooling components that generate high temperatures. The pad is electrically non-conductive, making it ideal for use in sensitive electronic devices, as it minimizes the risk of short circuits. The use of high-quality materials ensures excellent thermal conductivity, enhancing the performance and lifespan of hardware components. The Minus Pad Pro is easy to handle and can be applied effortlessly to various surfaces, making it a versatile choice for hobbyists and professionals alike.
- Excellent thermal conductivity for efficient cooling
- Electrically non-conductive, ideal for sensitive applications
- Easy handling and adaptation to different surfaces.

Benefit from the lowest thermal resistance with our award-winning thermal interface materials. Known for their outstanding quality, our high-performance thermal paste is a regular winner in performance tests. It offers very low thermal resistance due to its minimal bond line and is also easy to handle for beginners. Thermal pads in various designs and sizes complete the product range.

The Thermal Grizzly Minus Pad Pro is a highly advanced thermal pad specifically designed for efficient heat transfer in electronic applications. With a thickness of just 0.5 mm, it offers an optimal balance between flexibility and thermal conductivity. This product is ideal for use in various devices where effective heat dissipation is necessary to ensure the performance and longevity of components. The pad is non-electrically conductive, making it a safe choice for sensitive electronic parts. Each set includes two pads that are easy to adjust and install, ensuring reliable heat transfer.
- Excellent thermal conductivity for efficient heat transfer
- Non-electrically conductive, ideal for sensitive components
- Flexible design allows for easy adjustment and installation.

The Thermal Grizzly Minus Pad Pro is a high-performance thermal pad specifically designed for efficient heat transfer in electronic applications. With a thickness of 2 mm and a size of 120 x 20 mm, it offers an optimal fit for various components. This product is available in a convenient set of two pieces, making it an ideal choice for hardware repairs or upgrades. The use of high-quality materials ensures excellent thermal conductivity, contributing to improved cooling performance. The Minus Pad Pro is particularly suitable for use in areas where effective heat dissipation is necessary to maximize the lifespan and performance of devices. It is a reliable solution for tech enthusiasts and professionals who value quality and efficiency.
- Excellent thermal conductivity for efficient heat transfer
- Ideal for use in electronic applications and hardware upgrades
- Convenient set of two pieces for versatile applications.

Thermal Grizzly TG Minus Pad Pro - 120x20x2,0 mm 2 pcs
To achieve these goals, Thermal Grizzly has worked closely with and tested the well-known extreme overclocker Roman "der8auer" Hartung during product development, developing chemical compounds and analyzing competitors.
The features of the Thermal Grizzly Carbonaut thermal pad at a glance: Reusable, non-adhesive heat-conducting pad. Made of carbon-based polymer with nanoparticles. Extremely high thermal conductivity of 62.5 W/(m-K). 0.2 mm thick and 38 × 38 mm Intel CPUs for Socket 2066 and AMD CPUs for Socket AM4. Attention. Please observe the manufacturer's warnings before use. The Carbonaut is electrically conductive and is therefore not suitable for use on MOSFETS or voltage converters.
